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XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ...
XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ... more
Brand Name:XILINX
Model Number:XC6SLX16-2FTG256C
Place of Origin:TW
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Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ...
Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ... more
Bus Width:1-bit, 4-bit, 8-bit
Product Completion:Standard
Capacity:8gb/ 16gb/ 32gb/ 64gb/ 128gb/ 256gb
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... footprint technologies. From standard FPGAs to complex Micro-BGAs (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment and process maturity to ensure reliable interconnections. The challenge with BGA technology is visibility.
... footprint technologies. From standard FPGAs to complex Micro-BGAs (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment and process maturity to ensure reliable interconnections. The challenge with BGA technology is visibility. more
Brand Name:Dux PCB
Model Number:BGA Assembly
Place of Origin:China
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... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since
... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since more
Brand Name:TELIT
Model Number:GL865-QUAD
Place of Origin:China
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...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on
...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on more
Brand Name:Bicheng
Model Number:BIC-462.V1.0
Place of Origin:CHINA
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...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on
...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on more
Brand Name:Bicheng Technologies Limited
Model Number:BIC-462-V7.8
Place of Origin:China
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Ball Grid Array (BGA) 63164-136T Take Your Business to the Next Level with Contactor and Durable Product Description: A contactor is an essential component in electrical systems that are used to control the flow of electricity. It is a type of contact ...
Ball Grid Array (BGA) 63164-136T Take Your Business to the Next Level with Contactor and Durable Product Description: A contactor is an essential component in electrical systems that are used to control the flow of electricity. It is a type of contact ... more
Model Number:Ball Grid Array (BGA) 63164-136T
Minimum Order Quantity:1
Price:Negotiable
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PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers quick turn prototype and mass production High precision PCBs with the principle of “the Best quality, the ...
PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers quick turn prototype and mass production High precision PCBs with the principle of “the Best quality, the ... more
Brand Name:FASTPCBA
Model Number:Bga Pcb Assembly
Place of Origin:China
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Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & ...
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & ... more
Brand Name:UNICOMP
Model Number:AX9100max
Place of Origin:China
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OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ...
OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ... more
Brand Name:HNL-PCBA
Model Number:Rapid PCBA
Place of Origin:CHINA
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New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ...
New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ... more
Brand Name:Suntek
Model Number:FPA8569-NE4
Place of Origin:China
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Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ...
Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ... more
Brand Name:FASTPCB
Place of Origin:CHINA
Minimum Order Quantity:10PCS
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#detail_decorate_root .magic-0{width:750px}#detail_decorate_root .magic-1{overflow:hidden;width:750px;height:869.6202531645571px;margin-top:0;margin-bottom:0;margin-left:0;margin-right:0}#detail_decorate_root .magic-2{margin-top:0;margin-left:0;width:750....
#detail_decorate_root .magic-0{width:750px}#detail_decorate_root .magic-1{overflow:hidden;width:750px;height:869.6202531645571px;margin-top:0;margin-bottom:0;margin-left:0;margin-right:0}#detail_decorate_root .magic-2{margin-top:0;margin-left:0;width:750.... more
Place of Origin:United States
Series:SN74H164N, SN74H164N
Description:Integrated circuits
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Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our...
Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our... more
Brand Name:YDY
Model Number:E-002
Place of Origin:China
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...: unknown JESD - 30 : S - PBGA - B1357 code The number of terminals :1357 Packaging body material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE Encapsulated :Grid Array The power of: 1.2
...: unknown JESD - 30 : S - PBGA - B1357 code The number of terminals :1357 Packaging body material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE Encapsulated :Grid Array The power of: 1.2 more
Brand Name:INTEL
Model Number:WP81341M0820
Place of Origin:USA
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EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ...
EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ... more
Brand Name:Intel
Model Number:EP4CE40F23C8N
Minimum Order Quantity:1
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...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the
...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the more
Brand Name:Shinelink
Model Number:SL0925S01
Place of Origin:China
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...Ball Grid Array (BGA) components. It enables the removal and replacement of BGA components on printed circuit boards (PCBs), allowing for repairs and modifications to be made. The BGA rework station consists of several key components, including a heater, a
...Ball Grid Array (BGA) components. It enables the removal and replacement of BGA components on printed circuit boards (PCBs), allowing for repairs and modifications to be made. The BGA rework station consists of several key components, including a heater, a more
Brand Name:WZ
Model Number:WZ-580C WZ-620C WZ-650C WZ-750C
Place of Origin:China
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... Position BGA Rework Station Introduction: A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are ...
... Position BGA Rework Station Introduction: A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are ... more
Brand Name:HSTECH
Model Number:HS-620
Place of Origin:China
