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Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding Equipment is a high-end bonding equipment specifically designed for silicon carbide (SiC) power device manufacturing, supporting 2 to 12-inch wafer specifications. Wafer Bonding Equipment incorporates advanced room-temperature direct bonding and surface-activated bonding...
Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding Equipment is a high-end bonding equipment specifically designed for silicon carbide (SiC) power device manufacturing, supporting 2 to 12-inch wafer specifications. Wafer Bonding Equipment incorporates advanced room-temperature direct bonding and surface-activated bonding... more
Brand Name:ZMSH
Model Number:Wafer Bonding Equipment
Place of Origin:CHINA
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...silicon carbide (SiC) wafers, supporting both room temperature bonding and hydrophilic bonding techniques. It is capable of handling wafers of 4-inch, 6-inch, 8-inch, and 12-inch sizes, and is optimized for SiC-to-Si and SiC-to-SiC bonding applications.
...silicon carbide (SiC) wafers, supporting both room temperature bonding and hydrophilic bonding techniques. It is capable of handling wafers of 4-inch, 6-inch, 8-inch, and 12-inch sizes, and is optimized for SiC-to-Si and SiC-to-SiC bonding applications. more
Brand Name:ZMSH
Model Number:Wafer bonder equipment
Place of Origin:China
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Soft feeling and hydrophilic spun bonded pp non woven cloth for hygienic products Quick Detail: Material 100% Virgin Polypropylene Nonwoven Technics Spun-Bonded Pattern Embossed/Seasame Width 5-320cm/ 2”--126” Weight 10-150gsm MOQ 1500Kilograms Color ...
Soft feeling and hydrophilic spun bonded pp non woven cloth for hygienic products Quick Detail: Material 100% Virgin Polypropylene Nonwoven Technics Spun-Bonded Pattern Embossed/Seasame Width 5-320cm/ 2”--126” Weight 10-150gsm MOQ 1500Kilograms Color ... more
Brand Name:RAYSON
Model Number:RS-A123
Place of Origin:GUANGDONG, CHINA
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...Gas Monaka Wafer Production Equipment For Consistent Production Needs Product Description: The Automatic Monaka Wafer Production Line is a cutting-edge solution for producing delicious wafer biscuit, making it an essential piece of equipment for snack food...
...Gas Monaka Wafer Production Equipment For Consistent Production Needs Product Description: The Automatic Monaka Wafer Production Line is a cutting-edge solution for producing delicious wafer biscuit, making it an essential piece of equipment for snack food... more
Brand Name:STARLAND
Model Number:MW SERIES
Place of Origin:China
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...wafer oven UV LED wafer debonder machine wafer debonding Adhesive Peeling dessolver equipment Type: UV Lamp Light Power Intensity: 1-20W/cm2 Weight: 10 KG Power: 550w Warranty: 1 Year Cooling Method: Air Cooling Wavelength: 365nm Size: 366*158*360mm/customized Control Method: ON/OFF,PLC Selling Units: Single Item Product Application UV Printing,UV Glue,UV Adhesive,UV Bonding...
...wafer oven UV LED wafer debonder machine wafer debonding Adhesive Peeling dessolver equipment Type: UV Lamp Light Power Intensity: 1-20W/cm2 Weight: 10 KG Power: 550w Warranty: 1 Year Cooling Method: Air Cooling Wavelength: 365nm Size: 366*158*360mm/customized Control Method: ON/OFF,PLC Selling Units: Single Item Product Application UV Printing,UV Glue,UV Adhesive,UV Bonding... more
Brand Name:Bird UV
Model Number:BTW200
Place of Origin:Guangdong, China
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... and industry manufacturers. We has developed SiC crystal growth technology and SiC crystal wafer processing technology,established a production line to manufacturer SiCsubstrate,Which is applied in GaNepitaxydevice,powerdevices,high-temperature device and
... and industry manufacturers. We has developed SiC crystal growth technology and SiC crystal wafer processing technology,established a production line to manufacturer SiCsubstrate,Which is applied in GaNepitaxydevice,powerdevices,high-temperature device and more
Brand Name:PAM-XIAMEN
Place of Origin:China
Minimum Order Quantity:1-10,000pcs
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High Quality Automatic Wafer Making Machine / Wafer Line / Wafer Biscuit Making Machine Product Description Skywin is Professional Manufacturer specilized in Wafer machine,Wafer biscuit production line. It is full automatic control whole line. Our factory...
High Quality Automatic Wafer Making Machine / Wafer Line / Wafer Biscuit Making Machine Product Description Skywin is Professional Manufacturer specilized in Wafer machine,Wafer biscuit production line. It is full automatic control whole line. Our factory... more
Brand Name:SKYWIN
Place of Origin:CHINA
Certification:CE ISO9001
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PLC Control Cone Ice Cream Machine , Sugar Cone Wafer Processing Equipment Cone Ice Cream Machine Introduction Tunnel-type full automatic sugar cone making machine is a kind of machine which controlled by PLD,with complete automatization ,high capacity...
PLC Control Cone Ice Cream Machine , Sugar Cone Wafer Processing Equipment Cone Ice Cream Machine Introduction Tunnel-type full automatic sugar cone making machine is a kind of machine which controlled by PLD,with complete automatization ,high capacity... more
Brand Name:Gonghexiang
Model Number:SD80-61A
Place of Origin:China
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...Bonding Equipment For Lunch Box Or Thermal Cup Seal O Ring Material Production Product Description: The O Ring Bonding Machine is a highly efficient production machine designed for the automatic cutting and bonding of all O-rings. It has a cycle of operation of 12-15 seconds per piece, and can be customized to meet various weight requirements. It is also known as a Butyronitrile Ring Making Machine, Rubber ring bonding...
...Bonding Equipment For Lunch Box Or Thermal Cup Seal O Ring Material Production Product Description: The O Ring Bonding Machine is a highly efficient production machine designed for the automatic cutting and bonding of all O-rings. It has a cycle of operation of 12-15 seconds per piece, and can be customized to meet various weight requirements. It is also known as a Butyronitrile Ring Making Machine, Rubber ring bonding... more
Brand Name:HengChao
Model Number:HC-MFQ-02
Place of Origin:Guangzhou, China
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Suction Connecting Pipe Automatic Bonding Equipment, Pipe Length Can Be Customized Equipment function: Automatic gluing and bonding equipment for 1.7-1.5m connecting pipes. The equipment is directly connected to the extruder, and the manipulator ...
Suction Connecting Pipe Automatic Bonding Equipment, Pipe Length Can Be Customized Equipment function: Automatic gluing and bonding equipment for 1.7-1.5m connecting pipes. The equipment is directly connected to the extruder, and the manipulator ... more
Brand Name:Jzc
Model Number:Jzc-zjt01
Place of Origin:Suzhou China
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EPE Foaming Sheet Pipe Bonding Machine EPE foam rod/pipe/tube extrusion machine EPE Foaming Sheet Pipe Bonding Machine is used to stick both pe foam sheet together by electric heating or frame heating there are two types depending on the working style: I. ...
EPE Foaming Sheet Pipe Bonding Machine EPE foam rod/pipe/tube extrusion machine EPE Foaming Sheet Pipe Bonding Machine is used to stick both pe foam sheet together by electric heating or frame heating there are two types depending on the working style: I. ... more
Brand Name:XINTING
Model Number:XT105
Place of Origin:CHINA
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Ultrasonic Photoresist Coating Spray Gun for Silicon Wafers Painting Equipment What is the ultrasonic spray nozzle? An ultrasonic glue spray coating machine is a specialized device designed to apply adhesive coatings using ...
Ultrasonic Photoresist Coating Spray Gun for Silicon Wafers Painting Equipment What is the ultrasonic spray nozzle? An ultrasonic glue spray coating machine is a specialized device designed to apply adhesive coatings using ... more
Brand Name:RPS-SONIC
Model Number:RPS-WH-100
Place of Origin:China
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Acf / Cof Bonding Machine Pulse Hot Press Equipment to Repair LCD TV Screen What LCD Panel Problems our TAB Bonding Machine can solve out? you will find answers in the below: Screen failure: Vertical, horizontal, vertical, horizontal, black belt, the black...
Acf / Cof Bonding Machine Pulse Hot Press Equipment to Repair LCD TV Screen What LCD Panel Problems our TAB Bonding Machine can solve out? you will find answers in the below: Screen failure: Vertical, horizontal, vertical, horizontal, black belt, the black... more
Brand Name:CHUANGLIYOU
Model Number:616dh
Place of Origin:China
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... method commonly used in plastic product processing and production. The DS400 series is also equipped with a new generation of digital ultrasonic generators; The entire series is equipped with a 4.3-inch internal touch screen as standard, which is used in
... method commonly used in plastic product processing and production. The DS400 series is also equipped with a new generation of digital ultrasonic generators; The entire series is equipped with a 4.3-inch internal touch screen as standard, which is used in more
Brand Name:QRsonic
Model Number:FSWD-DS400
Place of Origin:China
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20kHz 4800W Ultrasonic Metal Bonding Equipment For Metal Terminal Welding Technical Parameters: Product Name Ultrasonic Metal Bonding Equipment Model TH-M Frequency 20KHz Power Range <=4800W Welding Force 1200 Newton Max. Control Voltage 24V ...
20kHz 4800W Ultrasonic Metal Bonding Equipment For Metal Terminal Welding Technical Parameters: Product Name Ultrasonic Metal Bonding Equipment Model TH-M Frequency 20KHz Power Range <=4800W Welding Force 1200 Newton Max. Control Voltage 24V ... more
Brand Name:Dongho
Model Number:TH-M2048
Place of Origin:China
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Semi Automatic Tin Soldering Machine smt bonding equipment soldering machine 1. Operational Mechanism: Manual- Automatic Hybrid - Semi-Automated Solder Feeding The machine automatically dispenses solder wire via a motor-driven feeder, triggered by a foot ...
Semi Automatic Tin Soldering Machine smt bonding equipment soldering machine 1. Operational Mechanism: Manual- Automatic Hybrid - Semi-Automated Solder Feeding The machine automatically dispenses solder wire via a motor-driven feeder, triggered by a foot ... more
Brand Name:ZT
Model Number:ZT-DHJ030
Place of Origin:China
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Semiconductor Automatic Slicing Machine Features: Chip Sorting Machine Product Name: Chip Sorting Machine Power Consumption: 2.5kW Sorting Speed: Up To 500 Chips Per Minute Air Consumption: 0.1m³/min Sorting Method: Optical Sorting Air Pressure: 0.6-0.8MPa...
Semiconductor Automatic Slicing Machine Features: Chip Sorting Machine Product Name: Chip Sorting Machine Power Consumption: 2.5kW Sorting Speed: Up To 500 Chips Per Minute Air Consumption: 0.1m³/min Sorting Method: Optical Sorting Air Pressure: 0.6-0.8MPa... more
Brand Name:TJIN
Place of Origin:China
Certification:ISO9001
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#detail_decorate_root .magic-0{width:750px}#detail_decorate_root .magic-1{overflow:hidden;width:750px;height:109.375px;margin-top:0;margin-bottom:0;margin-left:0;margin-right:0}#detail_decorate_root .magic-2{margin-top:0;margin-left:0;width:750px;height:... more
Brand Name:GAOQI
Place of Origin:Jiangsu, China
Condition:New
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...Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die bonding...
...Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die bonding... more
Brand Name:Suneast
Model Number:WBD2200 PLUS
Place of Origin:Shenzhen, Guangdong Province, China
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Metal Bond Diamond Grinding Wheel for Silicon Sapphire Wafer Edge Grinding Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of sillicon wafers, which requires uniform sharpness in addition to precision accuracy...
Metal Bond Diamond Grinding Wheel for Silicon Sapphire Wafer Edge Grinding Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of sillicon wafers, which requires uniform sharpness in addition to precision accuracy... more
Brand Name:Shine Abrasives
Model Number:4V2 1A1 14A2
Place of Origin:China
